3D embedded freeform electrical circuitry in metal componentry

Tho truong Nguyen, Tho Truong

Research output: Contribution to conferencePaperpeer-review

Abstract

A novel embedding process combining the use an ultrasonic solid-state welding technique coupled with a material direct writing technique to embed electronic devices and to print conductive features inside a three dimensional metallic housing container is proposed. This process has the advantages of (i) inexpensive fabrication, (ii) flexibility in sizes of embedded devices, and (iii) allowing for arrangement of embedded components in 3D. A fully functional demonstrator of a complete 3D LED circuitry has been successfully fabricated as the results of our fundamental researches gathered.
Original languageEnglish
Publication statusPublished - 1 Aug 2016
Externally publishedYes
EventSolid Freeform Fabrication (SFF) Conference -
Duration: 8 Jan 2016 → …

Conference

ConferenceSolid Freeform Fabrication (SFF) Conference
Period8/01/16 → …

Keywords

  • Additive manufacturing
  • 3D
  • Ultrasonic solid state welding
  • Material direct writing
  • Conductivity
  • Surface roughness

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