Abstract
A novel embedding process combining the use an ultrasonic solid-state welding technique coupled with a material direct writing technique to embed electronic devices and to print conductive features inside a three dimensional metallic housing container is proposed. This process has the advantages of (i) inexpensive fabrication, (ii) flexibility in sizes of embedded devices, and (iii) allowing for arrangement of embedded components in 3D. A fully functional demonstrator of a complete 3D LED circuitry has been successfully fabricated as the results of our
fundamental researches gathered.
Original language | English |
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Publication status | Published - 1 Aug 2016 |
Externally published | Yes |
Event | Solid Freeform Fabrication (SFF) Conference - Duration: 8 Jan 2016 → … |
Conference
Conference | Solid Freeform Fabrication (SFF) Conference |
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Period | 8/01/16 → … |
Keywords
- Additive manufacturing
- 3D
- Ultrasonic solid state welding
- Material direct writing
- Conductivity
- Surface roughness