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The importance of wavelength for tight temperature control during μ-laser-assisted machining
Saurav Goel
Mechanical Engineering and Design
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Keyphrases
Temperature Control
100%
Tight
100%
Ductile Machining
100%
Laser Machining
100%
Semiconductors
50%
Brittle Materials
50%
Laser Wavelength
50%
Diamond Tool
50%
High Material Removal Rate
50%
Sample Calculations
50%
Continuous Wave
50%
High-pressure Phase
50%
Machining Properties
50%
Laser-assisted
50%
Micro-laser Assisted Machining
50%
Thermal Softening
50%
Neodymium-doped Yttrium Aluminum Garnet Laser
50%
W-continuous
50%
Single-point Diamond Turning
50%
Engineering
Assisted Machining
100%
Target Temperature
50%
Diamond Tool
50%
Material Removal Rate
50%
Pressure Phase
50%
Ductile Machining
50%
Yttrium-Aluminum-Garnet
50%
Laser Wavelength
50%
Thermal Softening
50%
Continuous Wave
50%
Laser Micro
50%
Diamond Turning
50%
Ductile Mode
50%
Brittleness
50%
Material Science
Machining
100%
Diamond
40%
Brittleness
20%
Silicon
20%
Aluminum
20%
Neodymium
20%
Yttrium
20%
Garnet
20%